Inventor

SOHN KEUNGJIN

KR6 patents

⚠️ This page may combine multiple inventors who share the name “SOHN KEUNGJIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRO MECH

2 patents

US7893527B2Feb 22, 2011

Semiconductor plastic package and fabricating method thereof

SAMSUNG ELECTRO MECH14 citations82

US8030752B2Oct 4, 2011

Method of manufacturing semiconductor package and semiconductor plastic package using the same

SAMSUNG ELECTRO MECH2 citations59

SHIN JOON-SIK

1 patent

US8647926B2Feb 11, 2014

Method of fabricating semiconductor plastic package including a core board, build-up insulation layer, printed circuit, and semiconductor chip

SHIN JOON-SIK4 citations68

PARK JUNG-HWAN

1 patent

US8499441B2Aug 6, 2013

Method of manufacturing a printed circuit board

PARK JUNG-HWAN2 citations60

IKEGUCHI NOBUYUKI

1 patent

US8174128B2May 8, 2012

Method of manufacturing semiconductor package having a first board, second boards electrically connected to both sides of the first board, and at least one component connected to the first board by a flip chip method

IKEGUCHI NOBUYUKI5 citations57

SOHN KEUNGJIN

1 patent

US8997340B2Apr 7, 2015

Method of manufacturing and insulating sheet

SOHN KEUNGJIN1 citations44