Inventor

KANG GIL-MAN

KR2 patents

Patents

2 patents

US10692833B2Jun 23, 2020

Apparatus for correcting a parallelism between a bonding head and a stage, and a chip bonder including the same

SAMSUNG ELECTRONICS CO LTD8 citations79

US11482505B2Oct 25, 2022

Chip bonding apparatus

SAMSUNG ELECTRONICS CO LTD1 citations57