Inventor
LEE SUNG BOK
US34 patents
⚠️ This page may combine multiple inventors who share the name “LEE SUNG BOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KNOWLES ELECTRONICS LLC
29 patentsUS7023066B2Apr 4, 2006
Silicon microphone
KNOWLES ELECTRONICS LLC67 citations98
US9078063B2Jul 7, 2015
Microphone assembly with barrier to prevent contaminant infiltration
KNOWLES ELECTRONICS LLC52 citations95
US10939214B2Mar 2, 2021
Acoustic transducers with a low pressure zone and diaphragms having enhanced compliance
KNOWLES ELECTRONICS LLC16 citations93
US8969980B2Mar 3, 2015
Vented MEMS apparatus and method of manufacture
KNOWLES ELECTRONICS LLC20 citations92
US6987859B2Jan 17, 2006
Raised microstructure of silicon based device
KNOWLES ELECTRONICS LLC21 citations92
US10362408B2Jul 23, 2019
Differential MEMS microphone
KNOWLES ELECTRONICS LLC14 citations84
US9137595B2Sep 15, 2015
Apparatus for prevention of pressure transients in microphones
KNOWLES ELECTRONICS LLC16 citations84
US9479854B2Oct 25, 2016
Microphone assembly with barrier to prevent contaminant infiltration
KNOWLES ELECTRONICS LLC8 citations81
US11787688B2Oct 17, 2023
Methods of forming MEMS diaphragms including corrugations
KNOWLES ELECTRONICS LLC4 citations74
US11617042B2Mar 28, 2023
Acoustic transducers with a low pressure zone and diaphragms having enhanced compliance
KNOWLES ELECTRONICS LLC3 citations72
US11297406B2Apr 5, 2022
Acoustic transducers with a low pressure zone and diaphragms having a pressure sensor
KNOWLES ELECTRONICS LLC3 citations72
US11206494B2Dec 21, 2021
Microphone device with ingress protection
KNOWLES ELECTRONICS LLC5 citations72
US10349184B2Jul 9, 2019
Microphone and pressure sensor
KNOWLES ELECTRONICS LLC3 citations72
US11787690B1Oct 17, 2023
MEMS assembly substrates including a bond layer
KNOWLES ELECTRONICS LLC3 citations71
US10433071B2Oct 1, 2019
Microphone with hydrophobic ingress protection
KNOWLES ELECTRONICS LLC3 citations70
US9743191B2Aug 22, 2017
Acoustic apparatus with diaphragm supported at a discrete number of locations
KNOWLES ELECTRONICS LLC4 citations70
US10654712B2May 19, 2020
Elevated MEMS device in a microphone with ingress protection
KNOWLES ELECTRONICS LLC4 citations69
US11310600B2Apr 19, 2022
Acoustic transducer with reduced damping
KNOWLES ELECTRONICS LLC0 citations62
US11212621B2Dec 28, 2021
Composite diaphragms having balanced stress
KNOWLES ELECTRONICS LLC0 citations62
US11671766B2Jun 6, 2023
Microphone device with ingress protection
KNOWLES ELECTRONICS LLC0 citations61
US11228845B2Jan 18, 2022
Systems and methods for acoustic hole optimization
KNOWLES ELECTRONICS LLC0 citations61
US10887712B2Jan 5, 2021
Post linearization system and method using tracking signal
KNOWLES ELECTRONICS LLC1 citations61
US10887700B2Jan 5, 2021
Acoustic apparatus with diaphragm supported at a discrete number of locations
KNOWLES ELECTRONICS LLC0 citations60
US10870577B2Dec 22, 2020
Methods of forming MEMS diaphragms including corrugations
KNOWLES ELECTRONICS LLC0 citations52
US10158943B2Dec 18, 2018
Apparatus and method to bias MEMS motors
KNOWLES ELECTRONICS LLC1 citations51
US10178478B2Jan 8, 2019
Acoustic apparatus with diaphragm supported at a discrete number of locations
KNOWLES ELECTRONICS LLC0 citations49
US9329199B2May 3, 2016
MEMS tilt sensor
KNOWLES ELECTRONICS LLC1 citations47
US10491980B2Nov 26, 2019
Multiple MEMS motor apparatus with common vent
KNOWLES ELECTRONICS LLC0 citations42
US11274034B2Mar 15, 2022
Acoustic relief in MEMS
KNOWLES ELECTRONICS LLC0 citations40
SAMSUNG ELECTRONICS CO LTD
4 patentsUS7898007B2Mar 1, 2011
Semiconductor devices including line patterns separated by cutting regions
SAMSUNG ELECTRONICS CO LTD17 citations84
US7186617B2Mar 6, 2007
Methods of forming integrated circuit devices having a resistor pattern and plug pattern that are made from a same material
SAMSUNG ELECTRONICS CO LTD4 citations63
US10930672B2Feb 23, 2021
Three-dimensional semiconductor memory devices
SAMSUNG ELECTRONICS CO LTD1 citations50
US10726931B2Jul 28, 2020
Operation method of memory controller and operation method of storage device
SAMSUNG ELECTRONICS CO LTD0 citations47