Inventor
FUSARO JAMES M
US4 patents
Patents
4 patentsUS7253503B1Aug 7, 2007
Integrated circuit device packages and substrates for making the packages
AMKOR TECHNOLOGY INC120 citations98
US6580159B1Jun 17, 2003
Integrated circuit device packages and substrates for making the packages
AMKOR TECHNOLOGY INC107 citations97
US6331451B1Dec 18, 2001
Methods of making thin integrated circuit device packages with improved thermal performance and substrates for making the packages
AMKOR TECHNOLOGY INC95 citations97
US6833609B1Dec 21, 2004
Integrated circuit device packages and substrates for making the packages
AMKOR TECHNOLOGY INC23 citations92