Inventor

WANG LONG-CHING

US32 patents

⚠️ This page may combine multiple inventors who share the name “WANG LONG-CHING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WANG LONG-CHING

ALPHA & OMEGA SEMICONDUCTOR INT LP

Method of making reverse conducting insulated gate bipolar transistor

Chip scale semiconductor package having back side metal layer and raised front side pad and method of making the same

Wafer level chip scale semiconductor package

Method for semi-wafer level packaging

Semiconductor package having thin substrate and method of making the same

Semiconductor package having thin substrate and method of making the same

Semiconductor package having reduced parasitic inductance

DMOS FET chip scale package and method of making the same

Semiconductor package having enlarged gate pad and method of making the same

Semiconductor package having wettable lead flanks and tie bars and method of making the same

Chip scale package (CSP) semiconductor device having thin substrate

Semiconductor package having wettable lead flank and method of making the same

Semiconductor package having mold locking feature

ALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD

Super-fast transient response (STR) AC/DC converter for high power density charging application

Super-fast transient response (STR) AC/DC Converter for high power density charging application

Semiconductor package having high mechanical strength

Semiconductor package and method of making the same

Common source land grid array package

Super-fast transient response (STR) AC/DC converter for high power density charging application

Power semiconductor package having integrated inductor, resistor and capacitor

MARVELL WORLD TRADE LTD

Method and apparatus for improving the reliability of a connection to a via in a substrate

Method and apparatus for incorporating passive devices in an integrated passive device separate from a die

Methods and apparatus for self-alignment of integrated circuit dies

Packaging arrangements including high density interconnect bridge

Method and apparatus for interconnecting stacked dies using metal posts

CHEN BOMY

Passive elements, articles, packages, semiconductor composites, and methods of manufacturing same

Passive elements, articles, packages, semiconductor composites, and methods of manufacturing same

BELL COMMUNICATIONS RES

PdIn ohmic contact to GaAs

SILICON STORAGE TECH INC

Passive elements, articles, packages, semiconductor composites, and methods of manufacturing same

TSAI CHEN LUNG

Panel based lead frame packaging method and device

INTEGRATED DEVICE TECH

Method of forming an oxide layer

WANG LONG CHING

Direction interactive member of a wrench