Inventor
JANG SAM BOK
KR2 patents
Patents
2 patentsUS6105567AAug 22, 2000
Wafer sawing apparatus having washing solution spray and suction devices for debris removal and heat dissipation
SAMSUNG ELECTRONICS CO LTD50 citations85
US6090220AJul 18, 2000
Method for transferring a wafer after removing a washing solution
SAMSUNG ELECTRONICS CO LTD5 citations51