Inventor

SHEN CHI-CHIH

TW38 patents

⚠️ This page may combine multiple inventors who share the name “SHEN CHI-CHIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHEN CHI-CHIH

PIXART IMAGING INC

Optical sensor module and sensor chip thereof

Optical component packaging structure

Optical component packaging structure

Optical component packaging structure

Sensor chip package structure and manufacturing method thereof

Optical sensor package module

Manufacturing method of sensor chip package structure

Far-infrared sensor packaging structure

Optical sensor package module and manufacturing method thereof

Miniaturized optical sensor package and manufacturing method thereof

Miniaturized optical sensor package and manufacturing method thereof

Optical sensor package module and manufacturing method thereof

Optical detecting device capable of preventing environmental pollution

Optical machine of smoke detector

Optical detecting module with preferred light utilization efficiency

Optical component packaging structure

Optical sensing module with multi-directional optical sensing function

Package structure

Optical module package structure and method thereof

Optical detecting device having gas emission and gas pressure reduction function

Packaged optical device having a specular reflection configuration

SHEN CHI-CHIH

Circuit substrate and method of fabricating the same and chip package structure

Package process

Package structure and package process

Stacked-type chip package structure and method of fabricating the same

Package process and package structure

Method of fabricating a stacked type chip package structure

Semiconductor device with a plurality of mark through substrate vias

ADVANCED SEMICONDUCTOR ENG

Method for forming stackable semiconductor device packages including openings with conductive bumps of specified geometries

Flip chip package structure and carrier thereof

Package process and package structure

Package process and package structure

Package process and package structure

(unassigned)

Method and apparatus for molding a flip chip semiconductor device

CHEN KUANG-HSIUNG

Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductors

SHEN CHI CHIH

Display panel with image capture module and assembling method of the same

CHANG YI-CHANG

Chip package with improved heat dissipation and manufacturing method thereof

WANG WEI CHUNG

Sensing device and image sensor module thereof