Inventor

BEDOIN ALEXIS

FR2 patents

Patents

2 patents

US9406662B2Aug 2, 2016

Flip-chip assembly process comprising pre-coating interconnect elements

COMMISSARIAT ENERGIE ATOMIQUE3 citations63

US9368472B2Jun 14, 2016

Flip-chip assembly process for connecting two components to each other

COMMISSARIAT ENERGIE ATOMIQUE1 citations38