Inventor
GUEUGNOT ALAIN
FR2 patents
Patents
2 patentsUS9406662B2Aug 2, 2016
Flip-chip assembly process comprising pre-coating interconnect elements
COMMISSARIAT ENERGIE ATOMIQUE3 citations63
US7645686B2Jan 12, 2010
Method of bonding chips on a strained substrate and method of placing under strain a semiconductor reading circuit
COMMISSARIAT ENERGIE ATOMIQUE1 citations48