Inventor
BAJWA ADEEL AHMAD
US7 patents
Patents
7 patentsUS11205633B2Dec 21, 2021
Methods of bonding of semiconductor elements to substrates, and related bonding systems
KULICKE & SOFFA IND INC6 citations81
US10861820B2Dec 8, 2020
Methods of bonding semiconductor elements to a substrate, including use of a reducing gas, and related bonding machines
KULICKE & SOFFA IND INC7 citations80
US11776933B2Oct 3, 2023
Methods of bonding semiconductor elements to a substrate, including use of a reducing gas, and related bonding machines
KULICKE & SOFFA IND INC2 citations69
US12381175B2Aug 5, 2025
Bonding systems, and methods of providing a reducing gas on a bonding system
KULICKE & SOFFA IND INC0 citations60
US12062636B2Aug 13, 2024
Bonding systems, and methods of providing a reducing gas on a bonding system
KULICKE & SOFFA IND INC0 citations60
US11616042B2Mar 28, 2023
Methods of bonding of semiconductor elements to substrates, and related bonding systems
KULICKE & SOFFA IND INC0 citations60
US11515286B2Nov 29, 2022
Methods of bonding of semiconductor elements to substrates, and related bonding systems
KULICKE & SOFFA IND INC0 citations49