Inventor
COLOSIMO JR THOMAS J
US21 patents
⚠️ This page may combine multiple inventors who share the name “COLOSIMO JR THOMAS J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KULICKE & SOFFA IND INC
20 patentsUS9502371B2Nov 22, 2016
Methods of forming wire interconnect structures
KULICKE & SOFFA IND INC14 citations91
US11205633B2Dec 21, 2021
Methods of bonding of semiconductor elements to substrates, and related bonding systems
KULICKE & SOFFA IND INC6 citations81
US9810641B2Nov 7, 2017
Systems and methods for measuring physical characteristics of semiconductor device elements using structured light
KULICKE & SOFFA IND INC7 citations80
US9478516B2Oct 25, 2016
Methods of operating bonding machines for bonding semiconductor elements, and bonding machines
KULICKE & SOFFA IND INC4 citations72
US9865560B2Jan 9, 2018
Methods of forming wire interconnect structures
KULICKE & SOFFA IND INC3 citations71
US9426898B2Aug 23, 2016
Thermocompression bonders, methods of operating thermocompression bonders, and interconnect methods for fine pitch flip chip assembly
KULICKE & SOFFA IND INC4 citations67
US10468373B2Nov 5, 2019
Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines
KULICKE & SOFFA IND INC4 citations66
US12431459B2Sep 30, 2025
Methods of monitoring gas byproducts of a bonding system, and related monitoring systems and bonding systems
KULICKE & SOFFA IND INC0 citations62
US10153247B2Dec 11, 2018
Methods of forming wire interconnect structures
KULICKE & SOFFA IND INC1 citations61
US9165902B2Oct 20, 2015
Methods of operating bonding machines for bonding semiconductor elements, and bonding machines
KULICKE & SOFFA IND INC2 citations61
US12381175B2Aug 5, 2025
Bonding systems, and methods of providing a reducing gas on a bonding system
KULICKE & SOFFA IND INC0 citations60
US12062636B2Aug 13, 2024
Bonding systems, and methods of providing a reducing gas on a bonding system
KULICKE & SOFFA IND INC0 citations60
US11616042B2Mar 28, 2023
Methods of bonding of semiconductor elements to substrates, and related bonding systems
KULICKE & SOFFA IND INC0 citations60
US12500204B2Dec 16, 2025
Bonding systems for bonding of semiconductor elements to substrates including a gas composition analyzer, and related methods
KULICKE & SOFFA IND INC0 citations55
US9847313B2Dec 19, 2017
Thermocompression bonders, methods of operating thermocompression bonders, and horizontal scrub motions in thermocompression bonding
KULICKE & SOFFA IND INC0 citations51
US9731378B2Aug 15, 2017
Thermocompression bonders, methods of operating thermocompression bonders, and horizontal correction motions using lateral force measurement in thermocompression bonding
KULICKE & SOFFA IND INC0 citations51
US9929121B2Mar 27, 2018
Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines
KULICKE & SOFFA IND INC1 citations50
US11515286B2Nov 29, 2022
Methods of bonding of semiconductor elements to substrates, and related bonding systems
KULICKE & SOFFA IND INC0 citations49
US10245668B2Apr 2, 2019
Fluxing systems, bonding machines including fluxing systems, and methods of operating the same
KULICKE & SOFFA IND INC0 citations49
US10352877B2Jul 16, 2019
Systems and methods for measuring physical characteristics of semiconductor device elements using structured light
KULICKE & SOFFA IND INC0 citations48