P

Inventor

SWINNEN BART

BE9 patents
⚠️ This page may combine multiple inventors who share the name “SWINNEN BART”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IMEC

3 patents
US7795113B2Sep 14, 2010

Method for bonding a die or substrate to a carrier

IMEC11 citations83
US9646930B2May 9, 2017

Semiconductor device having through-substrate vias

IMEC12 citations81
US10332850B2Jun 25, 2019

Method for producing contact areas on a semiconductor substrate

IMEC2 citations68

QUALCOMM INC

2 patents
US7939926B2May 10, 2011

Via first plus via last technique for IC interconnects

QUALCOMM INC15 citations92
US7985620B2Jul 26, 2011

Method of fabricating via first plus via last IC interconnect

QUALCOMM INC5 citations73

IMEC INTER UNI MICRO ELECTR

1 patent
US7566634B2Jul 28, 2009

Method for chip singulation

IMEC INTER UNI MICRO ELECTR53 citations93

ASML NETHERLANDS BV

1 patent
US7042552B1May 9, 2006

Alignment strategy optimization method

ASML NETHERLANDS BV33 citations91

TEZCAN DENIZ SABUNCUOGLU

1 patent
US8809188B2Aug 19, 2014

Method for fabricating through substrate vias

TEZCAN DENIZ SABUNCUOGLU4 citations68

KASKOUN KENNETH

1 patent
US8076768B2Dec 13, 2011

IC interconnect

KASKOUN KENNETH0 citations50