Inventor
SHAARAWI MOHAMMED S
US34 patents
⚠️ This page may combine multiple inventors who share the name “SHAARAWI MOHAMMED S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD DEVELOPMENT CO
28 patentsUS7387370B2Jun 17, 2008
Microfluidic architecture
HEWLETT PACKARD DEVELOPMENT CO10 citations79
US11583920B2Feb 21, 2023
Three-dimensional printing
HEWLETT PACKARD DEVELOPMENT CO1 citations73
US11389867B2Jul 19, 2022
Three-dimensional (3D) printing
HEWLETT PACKARD DEVELOPMENT CO1 citations73
US11207827B2Dec 28, 2021
Energy dosing for additive manufacturing
HEWLETT PACKARD DEVELOPMENT CO2 citations72
US11534824B2Dec 27, 2022
Composition
HEWLETT PACKARD DEVELOPMENT CO1 citations71
US12214421B2Feb 4, 2025
Three-dimensional (3D) printing
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US12121973B2Oct 22, 2024
Three-dimensional (3D) printing
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US12076917B2Sep 3, 2024
Energy dosing for additive manufacturing
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US12042858B2Jul 23, 2024
Three-dimensional printing
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US12042860B2Jul 23, 2024
Build material composition
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US12023738B2Jul 2, 2024
Creating a breakaway region
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US11753703B2Sep 12, 2023
Three-dimensional printing
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US11684978B2Jun 27, 2023
Build material composition
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US11633782B2Apr 25, 2023
Three-dimensional (3D) printing
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US11498130B2Nov 15, 2022
Three-dimensional printing
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US11433457B2Sep 6, 2022
Creating a breakaway region
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US10894406B2Jan 19, 2021
Thin film stacks
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US7543915B2Jun 9, 2009
Fluid ejection device
HEWLETT PACKARD DEVELOPMENT CO2 citations62
US7293359B2Nov 13, 2007
Method for manufacturing a fluid ejection device
HEWLETT PACKARD DEVELOPMENT CO4 citations62
US11998977B2Jun 4, 2024
Build material composition with metal powder and freeze-dried heteropolymer
HEWLETT PACKARD DEVELOPMENT CO0 citations61
US7585616B2Sep 8, 2009
Method for making fluid emitter orifice
HEWLETT PACKARD DEVELOPMENT CO5 citations61
US11958110B2Apr 16, 2024
Three-dimensional printing
HEWLETT PACKARD DEVELOPMENT CO0 citations59
US7798612B2Sep 21, 2010
Microfluidic architecture
HEWLETT PACKARD DEVELOPMENT CO2 citations58
US11318669B2May 3, 2022
Three-dimensional (3D) printing
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US10654270B2May 19, 2020
Printhead comprising a thin film passivation layer
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US10675867B2Jun 9, 2020
Thermal inkjet resistor circuit
HEWLETT PACKARD DEVELOPMENT CO0 citations51
US10272671B2Apr 30, 2019
Isolating failed resistors
HEWLETT PACKARD DEVELOPMENT CO0 citations51
US12005499B2Jun 11, 2024
Three-dimensional printing with melting point suppression agents
HEWLETT PACKARD DEVELOPMENT CO0 citations46