Inventor
WANG CHIN-HUA
TW93 patents
Patents
50 patentsUS9870975B1Jan 16, 2018
Chip package with thermal dissipation structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations84
US11557559B2Jan 17, 2023
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations75
US11984378B2May 14, 2024
Semiconductor package structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11967582B2Apr 23, 2024
Multi-chip device and method of formation
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11915992B2Feb 27, 2024
Method for forming package structure with lid
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11854929B2Dec 26, 2023
Semiconductor package and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11798897B2Oct 24, 2023
Package structure and methods of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11784130B2Oct 10, 2023
Structure and formation method of package with underfill
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11784061B2Oct 10, 2023
Chip package structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11637087B2Apr 25, 2023
Multi-chip device and method of formation
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11574861B2Feb 7, 2023
Semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11450622B2Sep 20, 2022
Semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11282756B2Mar 22, 2022
Organic interposer including stress-resistant bonding structures and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11264300B2Mar 1, 2022
Package structure with lid and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11011447B2May 18, 2021
Semiconductor package and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9748156B1Aug 29, 2017
Semiconductor package assembly, semiconductor package and forming method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US12568820B2Mar 3, 2026
Semiconductor package including lid with integrated heat pipe for thermal management and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12568824B2Mar 3, 2026
Package assembly including liquid alloy thermal interface material (TIM) and seal ring around the liquid alloy TIM and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12506090B2Dec 23, 2025
Semiconductor package including stress buffers and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12489027B2Dec 2, 2025
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12374561B2Jul 29, 2025
Chip package structure with ring dam
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12374636B2Jul 29, 2025
Semiconductor device package with stress reduction design
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12362197B2Jul 15, 2025
Semiconductor die package with ring structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12362256B2Jul 15, 2025
Method for forming semiconductor package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12347793B2Jul 1, 2025
Semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12341091B2Jun 24, 2025
Semiconductor packages having conductive patterns of redistribution structure having ellipse-like shape
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12334451B2Jun 17, 2025
Semiconductor package including package substrate with dummy via and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12327772B2Jun 10, 2025
Semiconductor package including stress-reduction structures and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12278156B2Apr 15, 2025
Semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12255118B2Mar 18, 2025
Package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12255119B2Mar 18, 2025
Package assembly including liquid alloy thermal interface material (TIM) and seal ring around the liquid alloy TIM and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12243800B2Mar 4, 2025
Package structure with lid and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12237277B2Feb 25, 2025
Package structure and methods of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12232307B2Feb 18, 2025
Dummy metal bonding pads for underfill application in semiconductor die packaging and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12218023B2Feb 4, 2025
Semiconductor package and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12191294B2Jan 7, 2025
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12191272B2Jan 7, 2025
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12183714B2Dec 31, 2024
Package structures and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US12113006B2Oct 8, 2024
Semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12074083B2Aug 27, 2024
Semiconductor die package with thermal management features
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12057363B2Aug 6, 2024
Chip package structure with multiple gap-filling layers and fabricating method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12033871B2Jul 9, 2024
Method for forming semiconductor die package with ring structure comprising recessed parts
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12009276B2Jun 11, 2024
Semiconductor package including lid with integrated heat pipe for thermal management and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11997842B2May 28, 2024
Dummy metal bonding pads for underfill application in semiconductor die packaging and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11984381B2May 14, 2024
Semiconductor package structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11973001B2Apr 30, 2024
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11894320B2Feb 6, 2024
Semiconductor device package with stress reduction design and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US11862549B2Jan 2, 2024
Semiconductor packages having conductive patterns of redistribution structure having ellipse-like shape
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11862528B2Jan 2, 2024
Method for forming semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11862580B2Jan 2, 2024
Semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
Showing the top 50 of 93 patents by PatentIndex Score.