Inventor
YANG CHE-CHIA
TW32 patents
Patents
32 patentsUS11749644B2Sep 5, 2023
Semiconductor device with curved conductive lines and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations86
US11264359B2Mar 1, 2022
Chip bonded to a redistribution structure with curved conductive lines
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations86
US12261102B2Mar 25, 2025
Semiconductor package and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations74
US11784130B2Oct 10, 2023
Structure and formation method of package with underfill
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11699668B2Jul 11, 2023
Semiconductor device package having warpage control and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10790164B1Sep 29, 2020
Method for forming package structure
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US12322703B2Jun 3, 2025
Eccentric via structures for stress reduction
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations64
US12557656B2Feb 17, 2026
Stacking via structures for stress reduction
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12538852B2Jan 27, 2026
Package structure containing chip structure with inclined sidewalls
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12444696B2Oct 14, 2025
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12406898B2Sep 2, 2025
Chip package structure with lid
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12387991B2Aug 12, 2025
Manufacturing method of semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12368080B2Jul 22, 2025
Chip package structure with ring structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12368114B2Jul 22, 2025
Semiconductor device package having warpage control and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12322704B2Jun 3, 2025
Package structure with underfill
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12266635B2Apr 1, 2025
Semiconductor device package having dummy dies
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12237276B2Feb 25, 2025
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12170238B2Dec 17, 2024
Semiconductor die package with multi-lid structures and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12125822B2Oct 22, 2024
Method of manufacturing a semiconductor device package having dummy dies
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12100664B2Sep 24, 2024
Semiconductor device with curved conductive lines and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12094828B2Sep 17, 2024
Eccentric via structures for stress reduction
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12033906B2Jul 9, 2024
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12033913B2Jul 9, 2024
Chip package structure with lid and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11978722B2May 7, 2024
Structure and formation method of package containing chip structure with inclined sidewalls
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11855008B2Dec 26, 2023
Stacking via structures for stress reduction
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11855004B2Dec 26, 2023
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11728233B2Aug 15, 2023
Chip package structure with ring structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11721643B2Aug 8, 2023
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11694941B2Jul 4, 2023
Semiconductor die package with multi-lid structures and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11670601B2Jun 6, 2023
Stacking via structures for stress reduction
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11990418B2May 21, 2024
Chip package structure with buffer structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12148684B2Nov 19, 2024
Package structure and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52