Inventor
WANG PEI-WEI
TW12 patents
Patents
12 patentsUS11600936B2Mar 7, 2023
Circuit board structure
UNIMICRON TECHNOLOGY CORP0 citations60
US11114782B2Sep 7, 2021
Method of manufacturing circuit board structure
UNIMICRON TECHNOLOGY CORP0 citations60
US12439529B2Oct 7, 2025
Plurality of build-up layers in a circuit board structure
UNIMICRON TECHNOLOGY CORP0 citations59
US11562972B2Jan 24, 2023
Manufacturing method of the chip package structure having at least one chip and at least one thermally conductive element
UNIMICRON TECHNOLOGY CORP0 citations57
US11145610B2Oct 12, 2021
Chip package structure having at least one chip and at least one thermally conductive element and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations57
US11545412B2Jan 3, 2023
Package structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations50
US10854803B2Dec 1, 2020
Manufacturing method of light emitting device package structure with circuit redistribution structure
UNIMICRON TECHNOLOGY CORP0 citations48
US10651358B2May 12, 2020
Light emitting device package structure with circuit redistribution structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations48
US12057381B2Aug 6, 2024
Circuit board having laminated build-up layers
UNIMICRON TECHNOLOGY CORP0 citations47
US11792918B2Oct 17, 2023
Co-axial via structure
UNIMICRON TECHNOLOGY CORP0 citations47
US11641720B2May 2, 2023
Circuit board and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations46
US10863618B2Dec 8, 2020
Composite substrate structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations40