Inventor
QU XIAOPENG
US26 patents
Patents
26 patentsUS11011449B1May 18, 2021
Apparatus and method for dissipating heat in multiple semiconductor device modules
MICRON TECHNOLOGY INC8 citations83
US11984440B2May 14, 2024
Semiconductor devices, semiconductor device packages, electronic systems including same, and related methods
MICRON TECHNOLOGY INC2 citations72
US11617284B2Mar 28, 2023
Assemblies including heat dispersing elements and related systems and methods
MICRON TECHNOLOGY INC2 citations72
US11587918B2Feb 21, 2023
Semiconductor devices, semiconductor device packages, electronic systems including same, and related methods
MICRON TECHNOLOGY INC2 citations72
US11515171B2Nov 29, 2022
Methods and apparatus for temperature modification and reduction of contamination in bonding stacked microelectronic devices
MICRON TECHNOLOGY INC4 citations72
US11348857B2May 31, 2022
Lidded microelectronic device packages and related systems, apparatus, and methods of manufacture
MICRON TECHNOLOGY INC2 citations72
US11211364B1Dec 28, 2021
Semiconductor device assemblies and systems with improved thermal performance and methods for making the same
MICRON TECHNOLOGY INC2 citations72
US10952352B2Mar 16, 2021
Assemblies including heat dispersing elements and related systems and methods
MICRON TECHNOLOGY INC2 citations72
US11348875B2May 31, 2022
Semiconductor devices with flexible connector array
MICRON TECHNOLOGY INC2 citations71
US12593692B2Mar 31, 2026
Thermal management of GPU-HBM package by microchannel integrated substrate
MICRON TECHNOLOGY INC0 citations62
US12243801B2Mar 4, 2025
Substrates for semiconductor device assemblies and systems with improved thermal performance and methods for making the same
MICRON TECHNOLOGY INC0 citations62
US12159811B2Dec 3, 2024
Lidded microelectronic device packages and related systems, apparatus, and methods of manufacture
MICRON TECHNOLOGY INC0 citations62
US12028962B2Jul 2, 2024
Thermal management of circuit boards
MICRON TECHNOLOGY INC0 citations62
US12015011B2Jun 18, 2024
Semiconductor device assemblies and systems with improved thermal performance and methods for making the same
MICRON TECHNOLOGY INC0 citations62
US11915997B2Feb 27, 2024
Thermal management of GPU-HBM package by microchannel integrated substrate
MICRON TECHNOLOGY INC0 citations62
US11557526B2Jan 17, 2023
Substrates for semiconductor device assemblies and systems with improved thermal performance and methods for making the same
MICRON TECHNOLOGY INC0 citations62
US11419239B2Aug 16, 2022
Thermal management of circuit boards
MICRON TECHNOLOGY INC0 citations62
US11270924B2Mar 8, 2022
Heat spreaders for multiple semiconductor device modules
MICRON TECHNOLOGY INC0 citations62
US11239133B2Feb 1, 2022
Apparatus and method for dissipating heat in multiple semiconductor device modules
MICRON TECHNOLOGY INC1 citations62
US10672679B2Jun 2, 2020
Heat spreaders for multiple semiconductor device modules
MICRON TECHNOLOGY INC1 citations62
US11908803B2Feb 20, 2024
Semiconductor devices with flexible connector array
MICRON TECHNOLOGY INC0 citations61
US11385281B2Jul 12, 2022
Heat spreaders for use in semiconductor device testing, such as burn-in testing
MICRON TECHNOLOGY INC0 citations60
US11011452B2May 18, 2021
Heat spreaders for semiconductor devices, and associated systems and methods
MICRON TECHNOLOGY INC1 citations60
US12078672B2Sep 3, 2024
Heat spreaders for use in semiconductor device testing, such as burn-in testing
MICRON TECHNOLOGY INC0 citations55
US11372043B2Jun 28, 2022
Heat spreaders for use in semiconductor device testing, such as burn-in testing
MICRON TECHNOLOGY INC0 citations55
US10653033B1May 12, 2020
Kits for enhanced cooling of components of computing devices and related computing devices, systems and methods
MICRON TECHNOLOGY INC0 citations51