Inventor
MOROE HIROFUMI
JP7 patents
Patents
7 patentsUS6687988B1Feb 10, 2004
Method for forming pin-form wires and the like
SHINKAWA KK115 citations96
US6581283B2Jun 24, 2003
Method for forming pin-form wires and the like
SHINKAWA KK113 citations95
US5953624ASep 14, 1999
Bump forming method
SHINKAWA KK116 citations93
US5848868ADec 15, 1998
Wafer conveying apparatus
SHINKAWA KK36 citations91
US6193130B1Feb 27, 2001
Bump bonding apparatus
SHINKAWA KK12 citations73
US6505823B2Jan 14, 2003
Apparatus for positioning a semiconductor pellet
SHINKAWA KK2 citations61
US6632703B2Oct 14, 2003
Method and apparatus for positioning a semiconductor pellet
SHINKAWA KK1 citations51