Inventor

WU YI-WEN

TW86 patents

⚠️ This page may combine multiple inventors who share the name “WU YI-WEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WU YI-WEN

TAIWAN SEMICONDUCTOR MFG CO LTD

Package structure with dam structure and method for forming the same

Integrated fan-out package and method of fabricating the same

Integrated fan-out package and method of fabricating the same

Method of forming Cu pillar bump with non-metal sidewall spacer and metal top cap

Via structure for packaging and a method of forming

Structure and formation method of chip package with fan-out feature

Dual-sided routing in 3D SiP structure

Package structure and method of fabricating the same

Integrated fan-out package and method of fabricating the same

Semiconductor device and method

Cu pillar bump with L-shaped non-metal sidewall protection structure

Integrated fan-out package and method of fabricating the same

Post-passivation interconnect structure and method of forming same

Packaging devices and methods

Hybrid micro-bump integration with redistribution layer

Bonding package components through plating

Bonding structures and methods forming the same

Package structure with adhesive element over semiconductor chip

Package structure

Package structure and method of fabricating the same

Package structure and method of fabricating the same

Package structure and method of fabricating the same

Structure and formation method of chip package with conductive support elements to reduce warpage

Forming bonding structures by using template layer as templates

Via structure for packaging and a method of forming

Method of making a pillar structure having a non-metal sidewall protection structure and integrated circuit including the same

Integrated fan-out package and method of fabricating the same

Semiconductor packages and methods of manufacturing the same

Semiconductor device and method

Package structure with fan-out feature

Dual-sided routing in 3D semiconductor system-in-package structure and methods of forming the same

Semiconductor package with improved interposer structure

Semiconductor package with improved interposer structure

Semiconductor devices and methods of manufacturing

HWANG CHIEN LING

Cu pillar bump with non-metal sidewall spacer and metal top cap

Cu pillar bump with non-metal sidewall protection structure

Post passivation interconnect with oxidation prevention layer

Cu pillar bump with L-shaped non-metal sidewall protection structure

LU WEN-HSIUNG

Forming wafer-level chip scale package structures with reduced number of seed layers

Package on package interconnect structure

Semiconductor package having protective layer with curved surface and method of manufacturing same

WU YI-WEN

Cu pillar bump with non-metal sidewall protection structure

Post-passivation interconnect structure and method of forming the same

CHEN HSIEN-WEI

Post-passivation interconnect structure AMD method of forming same

Semiconductor device with bump structure on an interconncet structure

TAIWAN SEMICONDUCTOR MFG

Packaging devices and methods

Method of making a conductive pillar bump with non-metal sidewall protection structure

CHENG MING-DA

Mechanisms for forming copper pillar bumps

LIM ZHENG-YI

Method of forming metal pillar

HWANG CHIEN-LING

Conductive feature for semiconductor substrate and method of manufacture