Inventor
WONG TECHI
TW45 patents
Patents
45 patentsUS11527474B2Dec 13, 2022
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations86
US11075151B2Jul 27, 2021
Fan-out package with controllable standoff
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations86
US10790162B2Sep 29, 2020
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD14 citations86
US11380666B2Jul 5, 2022
Fan-out package with cavity substrate
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US11101214B2Aug 24, 2021
Package structure with dam structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US10515827B2Dec 24, 2019
Method for forming chip package with recessed interposer substrate
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations84
US11600575B2Mar 7, 2023
Method for forming chip package structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11362010B2Jun 14, 2022
Structure and formation method of chip package with fan-out feature
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11322447B2May 3, 2022
Dual-sided routing in 3D SiP structure
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11322449B2May 3, 2022
Package with fan-out structures
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11296065B2Apr 5, 2022
Semiconductor packages and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11114311B2Sep 7, 2021
Chip package structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11062997B2Jul 13, 2021
Method for forming chip package structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10985100B2Apr 20, 2021
Chip package with recessed interposer substrate
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10804254B2Oct 13, 2020
Fan-out package with cavity substrate
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10468339B2Nov 5, 2019
Heterogeneous fan-out structure and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US12476198B2Nov 18, 2025
Package structure with adhesive element over semiconductor chip
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12131984B2Oct 29, 2024
Heterogeneous fan-out structure and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12100666B2Sep 24, 2024
Method for forming chip package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12046548B2Jul 23, 2024
Chip package with redistribution structure having multiple chips
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11670577B2Jun 6, 2023
Chip package with redistribution structure having multiple chips
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11646256B2May 9, 2023
Heterogeneous fan-out structure and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11600573B2Mar 7, 2023
Structure and formation method of chip package with conductive support elements to reduce warpage
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11018081B2May 25, 2021
Heterogeneous fan-out structure and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12564076B2Feb 24, 2026
Chip package with fan-out feature and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12532771B2Jan 20, 2026
Package structure with fan-out feature
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12308322B2May 20, 2025
Dual-sided routing in 3D semiconductor system-in-package structure and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12308313B2May 20, 2025
Semiconductor package with improved interposer structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12300592B2May 13, 2025
Fan-out package with controllable standoff
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12237262B2Feb 25, 2025
Semiconductor package with improved interposer structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12199084B2Jan 14, 2025
Fan-out package with cavity substrate
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12176337B2Dec 24, 2024
Semiconductor devices and methods of manufacturing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12170274B2Dec 17, 2024
Semiconductor packages and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12094819B2Sep 17, 2024
Method for forming package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12074104B2Aug 27, 2024
Integrated circuit packages with ring-shaped substrates
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11948892B2Apr 2, 2024
Formation method of chip package with fan-out feature
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11855059B2Dec 26, 2023
Fan-out package with cavity substrate
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11854955B2Dec 26, 2023
Fan-out package with controllable standoff
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11848265B2Dec 19, 2023
Semiconductor package with improved interposer structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11824007B2Nov 21, 2023
Dual-sided routing in 3D SiP structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11430776B2Aug 30, 2022
Semiconductor devices and methods of manufacturing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11239173B2Feb 1, 2022
Structure and formation method of chip package with fan-out feature
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11094625B2Aug 17, 2021
Semiconductor package with improved interposer structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11764159B2Sep 19, 2023
Package with fan-out structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US11682599B2Jun 20, 2023
Chip package structure with molding layer and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52