P

Inventor

HUNG SHIH-TING

TW40 patents
⚠️ This page may combine multiple inventors who share the name “HUNG SHIH-TING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

27 patents
US9520482B1Dec 13, 2016

Method of cutting metal gate

TAIWAN SEMICONDUCTOR MFG CO LTD3,161 citations98
US11164754B2Nov 2, 2021

Fan-out packages and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD9 citations86
US10347574B2Jul 9, 2019

Integrated fan-out packages

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9735042B2Aug 15, 2017

Dielectric punch-through stoppers for forming FinFETs having dual Fin heights

TAIWAN SEMICONDUCTOR MFG CO LTD10 citations84
US11302650B2Apr 12, 2022

Package structure and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11114311B2Sep 7, 2021

Chip package structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10879162B2Dec 29, 2020

Integrated fan-out packages

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9911805B2Mar 6, 2018

Silicon recess etch and epitaxial deposit for shallow trench isolation (STI)

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US9129823B2Sep 8, 2015

Silicon recess ETCH and epitaxial deposit for shallow trench isolation (STI)

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US12388028B2Aug 12, 2025

Package structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12051654B2Jul 30, 2024

Package structure and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11804451B2Oct 31, 2023

Package structure and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12382587B2Aug 5, 2025

Methods and systems for improving surface mount joinder

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12308313B2May 20, 2025

Semiconductor package with improved interposer structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12237262B2Feb 25, 2025

Semiconductor package with improved interposer structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12176337B2Dec 24, 2024

Semiconductor devices and methods of manufacturing

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11901277B2Feb 13, 2024

Semiconductor package and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11901279B2Feb 13, 2024

Semiconductor package and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11848265B2Dec 19, 2023

Semiconductor package with improved interposer structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11637054B2Apr 25, 2023

Semiconductor package and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11430776B2Aug 30, 2022

Semiconductor devices and methods of manufacturing

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11094625B2Aug 17, 2021

Semiconductor package with improved interposer structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12198996B2Jan 14, 2025

Integrated fan-out package, package-on-package structure, and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11075132B2Jul 27, 2021

Integrated fan-out package, package-on-package structure, and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11430739B2Aug 30, 2022

Structure and formation method of package structure with fan-out structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US9831322B2Nov 28, 2017

Channel epitaxial regrowth flow (CRF)

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9502533B2Nov 22, 2016

Silicon recess etch and epitaxial deposit for shallow trench isolation (STI)

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51

STRIKE IND INC

6 patents

TAIWAN SEMICONDUCTOR MFG

3 patents

HUNG SHIH-TING

2 patents

CHANG CHENG-HUNG

1 patent

LEE SHANYAO

1 patent