Inventor

MEYER THORSTEN

DE238 patents

⚠️ This page may combine multiple inventors who share the name “MEYER THORSTEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MEYER THORSTEN

INFINEON TECHNOLOGIES AG

Transfer wafer level packaging

Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device

Method of manufacturing a semiconductor device comprising stacked chips and a corresponding semiconductor device

Semiconductor component and method for its production

Method for connection of circuit units

Method for producing an electronic component having a plurality of chips that are stacked one above the other and contact-connected to one another

Semiconductor device and method of manufacture thereof

Semiconductor device

Method for producing chip packages, and chip package produced in this way

Semiconductor module

Method of producing a semiconductor component having a compliant buffer layer

Reconfigured wafer alignment

Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips

Semiconductor device with temperature sensor

Semiconductor device and method for fabricating the semiconductor device

Method of making pad-rerouting for integrated circuit chips

Composite board with semiconductor chips and plastic housing composition and method

Device and manufacturing method

MEYER THORSTEN

Stacked fan-out semiconductor chip

Flip-chip wafer level package and methods thereof

Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads

Chip with encapsulated sides and exposed surface

Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device

Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads

Enhanced flip chip package

Repairable semiconductor device and method

Semiconductor device including adhesive covered element

INTEL MOBILE COMM GMBH

Method of manufacturing a semiconductor device including removing a relief layer from back surface of semiconductor chip

Chip package-in-package and method thereof

Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips

Enhanced flip chip package

INTEL IP CORP

Package-on-package stacked microelectronic structures

Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)

Hybrid exposure for semiconductor devices

INTEL CORP

Microelectronic package having a passive microelectronic device disposed within a package body

Antenna on ceramics for a packaged die

Three dimensional structures within mold compound

INTEL DEUTSCHLAND GMBH

Semiconductor devices

Chip package-in-package

INFINEON TECHNOLOGIES AUSTRIA

Field plate trench transistor and method for producing it

Field plate trench transistor and method for producing it

DAIMLER BENZ AG

Gas pedal with friction structure

Control pedal unit for a vehicle

GANESAN SANKA

Package on package architecture and method for making

POHL JENS

Stackable semiconductor package with encapsulant and electrically conductive feed-through

BOECK JOSEF

Integrated antennas in wafer level package

SEZI RECAI

Semiconductor package and multichip arrangement having a polymer layer and an encapsulant

BARTH HANS-JOACHIM

On-chip RF shields with front side redistribution lines

JOHNSON CONTR INTERIORS GMBH

Adjustable armrest

ZUDOCK FRANK

Semiconductor device