Inventor

SCHARF THORSTEN

DE48 patents

⚠️ This page may combine multiple inventors who share the name “SCHARF THORSTEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SCHARF THORSTEN

INFINEON TECHNOLOGIES AG

Device including semiconductor chips and method for producing such device

Stacked die semiconductor package with electrical interposer

Circuit board embedding a power semiconductor chip

Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate

Device including semiconductor chips and method for producing such device

Method of forming a chip package and chip package

Plurality of transistor packages with exposed source and drain contacts mounted on a carrier

Semiconductor device arrangement with compressible adhesive

Device including semiconductor chips and method for producing such device

Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate

Device including semiconductor chips and method for producing such device

Device including semiconductor chips and method for producing such device

Processing of one or more carrier bodies and electronic components by multiple alignment

Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate

Semiconductor device comprising a composite material clip

Semiconductor package system

Semiconductor device having a carrier, semiconductor chip packages mounted on the carrier and a cooling element

Lead frame-based semiconductor package

Semiconductor package having a lead frame and a clip frame

Semiconductor device and method for fabricating the same

Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture

Semiconductor packages including electrical redistribution layers of different thicknesses and methods for manufacturing thereof

Batch manufacture of packages by sheet separated into carriers after mounting of electronic components

Package comprising carrier with chip and component mounted via opening

Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate

Package with separate substrate sections

Power semiconductor package having first and second lead frames

Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture

Temporary post-assisted embedding of semiconductor dies

Chip embedding package with solderable electric contact

Chip carriers and semiconductor devices including redistribution structures with improved thermal and electrical performance

INFINEON TECHNOLOGIES AUSTRIA AG

Chip-embedded packages with backside die connection

Method for fabricating a semiconductor device package comprising a pin in the form of a drilling screw

Semiconductor device package comprising a pin in the form of a drilling screw

SCHARF THORSTEN

Baler and method for operating a baler

Semiconductor device including single circuit element for soldering

Bale press

CLAAS FRANCE SAS

Twine retaining device for a baler

Baler

Block baling press

INFINEON TECHNOLOGIES DRESDEN GMBH

Semiconductor packages and methods of fabrication thereof

Semiconductor packages and methods of fabrication thereof

USINES CLAAS FRANCE SAS

Gear assembly for driving a ram of a square baler

Square baler

TEREX DEMAG GMBH

Rope winding system for winding and unwinding steel ropes of cranes

HEINRICH ALEXANDER

Bonding material with exothermically reactive heterostructures

CLAAS KGAA MBH

Combination of a towing vehicle and an agricultural harvesting machine drawn thereby including a control device for specifying a ground speed of the combination

INFINEON TECHNOLOGIES AUSTRIA

Semiconductor device including multiple semiconductor chips and a laminate