Inventor

CHAN PENG YEEN

MY3 patents

Patents

3 patents

US6467278B1Oct 22, 2002

Cooling for singulation of composite materials in molded semiconductor packages

NAT SEMICONDUCTOR CORP16 citations80

US7181835B2Feb 27, 2007

Universal clamping mechanism

NAT SEMICONDUCTOR CORP1 citations49

US6698088B2Mar 2, 2004

Universal clamping mechanism

NAT SEMICONDUCTOR CORP0 citations49