Inventor
SEO KANG-ILL
US104 patents
⚠️ This page may combine multiple inventors who share the name “SEO KANG-ILL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
45 patentsUS9601569B1Mar 21, 2017
Semiconductor device having a gate all around structure
SAMSUNG ELECTRONICS CO LTD23 citations94
US9425259B1Aug 23, 2016
Semiconductor device having a fin
SAMSUNG ELECTRONICS CO LTD21 citations93
US9397179B1Jul 19, 2016
Semiconductor device
SAMSUNG ELECTRONICS CO LTD19 citations93
US6642107B2Nov 4, 2003
Non-volatile memory device having self-aligned gate structure and method of manufacturing same
SAMSUNG ELECTRONICS CO LTD30 citations92
US11881455B2Jan 23, 2024
Through silicon buried power rail implemented backside power distribution network semiconductor architecture and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD5 citations84
US9755034B2Sep 5, 2017
Semiconductor device having nanowire
SAMSUNG ELECTRONICS CO LTD13 citations84
US9614068B2Apr 4, 2017
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD15 citations84
US9443978B2Sep 13, 2016
Semiconductor device having gate-all-around transistor and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD7 citations84
US9343370B1May 17, 2016
Method for fabricating semiconductor device
SAMSUNG ELECTRONICS CO LTD9 citations84
US9209179B2Dec 8, 2015
FinFET-based semiconductor device with dummy gates
SAMSUNG ELECTRONICS CO LTD14 citations84
US8927373B2Jan 6, 2015
Methods of fabricating non-planar transistors including current enhancing structures
SAMSUNG ELECTRONICS CO LTD9 citations84
US9735157B1Aug 15, 2017
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD15 citations82
US9679965B1Jun 13, 2017
Semiconductor device having a gate all around structure and a method for fabricating the same
SAMSUNG ELECTRONICS CO LTD11 citations81
US6573139B2Jun 3, 2003
Method of fabricating cell of flash memory device
SAMSUNG ELECTRONICS CO LTD10 citations74
US11502167B2Nov 15, 2022
Semiconductor device having stepped multi-stack transistor structure
SAMSUNG ELECTRONICS CO LTD4 citations73
US9923058B2Mar 20, 2018
Semiconductor device having a fin
SAMSUNG ELECTRONICS CO LTD2 citations73
US9905559B2Feb 27, 2018
Semiconductor device having fin-type field effect transistor and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD3 citations73
US9875791B2Jan 23, 2018
Semiconductor device
SAMSUNG ELECTRONICS CO LTD2 citations73
US9754660B2Sep 5, 2017
Semiconductor device
SAMSUNG ELECTRONICS CO LTD2 citations73
US9735153B2Aug 15, 2017
Semiconductor device having fin-type field effect transistor and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations73
US9653462B2May 16, 2017
Semiconductor device and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD5 citations73
US9472653B2Oct 18, 2016
Method for fabricating semiconductor device
SAMSUNG ELECTRONICS CO LTD3 citations73
US9362311B1Jun 7, 2016
Method of fabricating semiconductor device
SAMSUNG ELECTRONICS CO LTD4 citations73
US9257327B2Feb 9, 2016
Methods of forming a Field Effect Transistor, including forming a region providing enhanced oxidation
SAMSUNG ELECTRONICS CO LTD4 citations73
US12356665B2Jul 8, 2025
Stacked transistors having an isolation region therebetween and a common gate electrode, and related fabrication methods
SAMSUNG ELECTRONICS CO LTD2 citations72
US12170322B2Dec 17, 2024
Devices including stacked nanosheet transistors
SAMSUNG ELECTRONICS CO LTD2 citations72
US9570434B2Feb 14, 2017
Semiconductor device and fabricating method thereof
SAMSUNG ELECTRONICS CO LTD3 citations72
US12230571B2Feb 18, 2025
Integrated circuit devices including a power rail and methods of forming the same
SAMSUNG ELECTRONICS CO LTD3 citations71
US12125788B2Oct 22, 2024
Through silicon buried power rail implemented backside power distribution network semiconductor architecture and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US12230570B2Feb 18, 2025
Integrated circuit with buried power rail and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations63
US12119351B2Oct 15, 2024
Semiconductor device having fin-type field effect transistor and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations63
US11233008B2Jan 25, 2022
Method of manufacturing an integrated circuit with buried power rail
SAMSUNG ELECTRONICS CO LTD1 citations63
US11177260B2Nov 16, 2021
Semiconductor device having fin-type field effect transistor and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations63
US10790278B2Sep 29, 2020
Semiconductor device including vertical field effect transistors having different gate lengths
SAMSUNG ELECTRONICS CO LTD1 citations63
US12543347B2Feb 3, 2026
Different diffusion break structures for three-dimensional stacked semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations62
US12464803B2Nov 4, 2025
Multi-fin vertical field effect transistor and single-fin vertical field effect transistor on a single integrated circuit chip
SAMSUNG ELECTRONICS CO LTD0 citations62
US12389660B1Aug 12, 2025
Semiconductor device including backside contact structure with silicide layer formed in FEOL process
SAMSUNG ELECTRONICS CO LTD0 citations62
US12317588B2May 27, 2025
Step-stacked nanowire CMOS structure for low power logic device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US12317582B2May 27, 2025
Integrated circuit devices including a metal resistor and methods of forming the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US12310062B2May 20, 2025
Integrated circuit devices including stacked transistors and methods of forming the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US12310106B2May 20, 2025
Devices including stacked nanosheet transistors
SAMSUNG ELECTRONICS CO LTD0 citations62
US12274092B2Apr 8, 2025
Resistance measuring structures of stacked devices
SAMSUNG ELECTRONICS CO LTD0 citations62
US12199152B2Jan 14, 2025
Selective single diffusion/electrical barrier
SAMSUNG ELECTRONICS CO LTD0 citations62
US12183786B2Dec 31, 2024
Multi-stack semiconductor device with zebra nanosheet structure
SAMSUNG ELECTRONICS CO LTD0 citations62
US12094869B2Sep 17, 2024
Diode structures of stacked devices and methods of forming the same
SAMSUNG ELECTRONICS CO LTD0 citations62
KIM DONG-KWON
1 patentMING LI
1 patentSEO KANG-ILL
1 patentSUK SUNG-DAE
1 patentSEO KANG ILL
1 patentShowing the top 50 of 104 patents by PatentIndex Score.