Inventor
TAGUCHI MITSURU
25 patents
⚠️ This page may combine multiple inventors who share the name “TAGUCHI MITSURU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SONY CORP
20 patentsUS6380065B1Apr 30, 2002
Interconnection structure and fabrication process therefor
SONY CORP69 citations96
US5308793AMay 3, 1994
Method for forming interconnector
SONY CORP59 citations96
US6361662B1Mar 26, 2002
Method for fabricating a semiconductor device in a magnetron sputtering system
SONY CORP66 citations95
US6709979B2Mar 23, 2004
Method of manufacturing a semiconductor device
SONY CORP21 citations92
US6593246B1Jul 15, 2003
Process for producing semiconductor device
SONY CORP32 citations92
US6333258B1Dec 25, 2001
Method of manufacturing a semiconductor device
SONY CORP26 citations92
US6306761B1Oct 23, 2001
Method of manufacturing semiconductor device
SONY CORP25 citations92
US6191031B1Feb 20, 2001
Process for producing multi-layer wiring structure
SONY CORP21 citations92
US5985747ANov 16, 1999
Semiconductor device manufacturing method
SONY CORP27 citations92
US5776830AJul 7, 1998
Process for fabricating connection structures
SONY CORP22 citations92
US5719446AFeb 17, 1998
Multilayer interconnect structure for semiconductor device and method of manufacturing same
SONY CORP39 citations90
US6645852B1Nov 11, 2003
Process for fabricating a semiconductor device having recess portion
SONY CORP19 citations88
US6878632B2Apr 12, 2005
Semiconductor device having a conductive layer with a cobalt tungsten phosphorus coating and a manufacturing method thereof
SONY CORP17 citations84
US6268290B1Jul 31, 2001
Method of forming wirings
SONY CORP15 citations84
US6465342B1Oct 15, 2002
Semiconductor device and its manufacturing method
SONY CORP7 citations74
US6051490AApr 18, 2000
Method of forming wirings
SONY CORP9 citations74
US6602787B2Aug 5, 2003
Method for fabricating semiconductor devices
SONY CORP9 citations73
US6197686B1Mar 6, 2001
Aluminum metallization by a barrier metal process
SONY CORP11 citations73
US6736699B2May 18, 2004
Electrolytic polishing apparatus, electrolytic polishing method and wafer subject to polishing
SONY CORP5 citations62
USRE40748EJun 16, 2009
Process for producing semiconductor device
SONY CORP1 citations52