Inventor
ZIMMERMAN RICHARD HENRY
4 patents
Patents
4 patentsUS4089733AMay 16, 1978
Method of forming complex shaped metal-plastic composite lead frames for IC packaging
AMP INC87 citations93
US4048438ASep 13, 1977
Conductor patterned substrate providing stress release during direct attachment of integrated circuit chips
AMP INC83 citations93
US4078096AMar 7, 1978
Method of making sensitized polyimide polymers, having catalyst and electroless metal, metal deposits thereon and circuit patterns of various metallization schemes
AMP INC44 citations91
US3967162AJun 29, 1976
Interconnection of oppositely disposed circuit devices
AMP INC46 citations89