Inventor
MIYASAKA YOICHI
JP59 patents
⚠️ This page may combine multiple inventors who share the name “MIYASAKA YOICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEIKO EPSON CORP
30 patentsUS11028536B2Jun 8, 2021
Defibrated material manufacturing device, and sheet manufacturing apparatus
SEIKO EPSON CORP6 citations84
US7381449B2Jun 3, 2008
Method for coating material, method of manufacturing color filter substrate, method of manufacturing electroluminescence display device, method of manufacturing plasma display device, and ejection device
SEIKO EPSON CORP17 citations84
US7601219B2Oct 13, 2009
Apparatus for ejecting liquid droplet, work to be applied thereto, method of manufacturing electro-optic device, electro-optic device, and electronic equipment
SEIKO EPSON CORP5 citations74
US7592032B2Sep 22, 2009
Method of recognizing image of nozzle hole and method of correcting position of liquid droplet ejection head using the same; method of inspecting nozzle hole; apparatus for recognizing image of nozzle hole and liquid droplet ejection apparatus equipped with the same; method of manufacturing electro-optical device; electro-optical device; and electronic equipment
SEIKO EPSON CORP7 citations74
US7399051B2Jul 15, 2008
Ejection device, material coating method, method of manufacturing color filter substrate, method of manufacturing electroluminescence display device, and method of manufacturing plasma display device
SEIKO EPSON CORP7 citations74
US9738996B2Aug 22, 2017
Sheet manufacturing apparatus
SEIKO EPSON CORP2 citations73
US11059294B2Jul 13, 2021
Liquid absorber, liquid absorbing unit, and liquid ejection apparatus
SEIKO EPSON CORP2 citations72
US11052660B2Jul 6, 2021
Liquid absorber and liquid ejection apparatus
SEIKO EPSON CORP2 citations72
US11319674B2May 3, 2022
Fibrous body manufacturing apparatus and fibrous body manufacturing method
SEIKO EPSON CORP1 citations63
US11891753B2Feb 6, 2024
Fiber structure manufacturing apparatus, method of manufacturing fiber structure, and fiber structure
SEIKO EPSON CORP0 citations62
US11491790B2Nov 8, 2022
Liquid absorber, liquid-absorbing sheet, liquid absorbent, and image-forming apparatus
SEIKO EPSON CORP0 citations62
US11427005B2Aug 30, 2022
Liquid absorber
SEIKO EPSON CORP0 citations62
US11427002B2Aug 30, 2022
Liquid absorbing structure and liquid droplet ejecting apparatus
SEIKO EPSON CORP0 citations62
US11351788B2Jun 7, 2022
Liquid absorber and image forming apparatus
SEIKO EPSON CORP0 citations62
US11279135B2Mar 22, 2022
Ink absorption member
SEIKO EPSON CORP0 citations62
US11072179B2Jul 27, 2021
Liquid absorbent body, liquid absorber, and liquid treatment apparatus
SEIKO EPSON CORP0 citations62
US11046079B2Jun 29, 2021
Liquid absorber and liquid ejection apparatus
SEIKO EPSON CORP0 citations62
US10981353B2Apr 20, 2021
Absorbent composite
SEIKO EPSON CORP0 citations62
US10953654B2Mar 23, 2021
Ink absorber, ink absorbing member accommodation container, and ink absorbing structure
SEIKO EPSON CORP0 citations62
US10920347B2Feb 16, 2021
Sheet manufactured from recyclable materials
SEIKO EPSON CORP0 citations62
US10676867B2Jun 9, 2020
Defibrated material manufacturing device, and sheet manufacturing apparatus
SEIKO EPSON CORP1 citations62
US7566636B2Jul 28, 2009
Method of scribing stuck mother substrate and method of dividing stuck mother substrate
SEIKO EPSON CORP3 citations62
US12123136B2Oct 22, 2024
Raw material supply device
SEIKO EPSON CORP0 citations52
US11890790B2Feb 6, 2024
Pressing machine
SEIKO EPSON CORP0 citations52
US11814762B2Nov 14, 2023
Fiber structure manufacturing apparatus, fiber structure manufacturing method, and fiber structure
SEIKO EPSON CORP0 citations52
US11724414B2Aug 15, 2023
Defibrated material manufacturing device
SEIKO EPSON CORP0 citations52
US11305954B2Apr 19, 2022
Used paper supply device and sheet manufacturing apparatus
SEIKO EPSON CORP0 citations52
US11052664B2Jul 6, 2021
Liquid absorbing device, control method for liquid absorbing device, and liquid absorbing material
SEIKO EPSON CORP0 citations52
US10870281B2Dec 22, 2020
Liquid absorber, ink absorbing device, and liquid droplet ejection apparatus
SEIKO EPSON CORP0 citations52
US10041199B2Aug 7, 2018
Sheet manufacturing apparatus
SEIKO EPSON CORP0 citations52
NEC CORP
10 patentsUS6225133B1May 1, 2001
Method of manufacturing thin film capacitor
NEC CORP138 citations98
US5122923AJun 16, 1992
Thin-film capacitors and process for manufacturing the same
NEC CORP165 citations98
US5053917AOct 1, 1991
Thin film capacitor and manufacturing method thereof
NEC CORP172 citations98
US5084438AJan 28, 1992
Electronic device substrate using silicon semiconductor substrate
NEC CORP102 citations95
US5539613AJul 23, 1996
Compact semiconductor device including a thin film capacitor of high reliability
NEC CORP27 citations92
US5498561AMar 12, 1996
Method of fabricating memory cell for semiconductor integrated circuit
NEC CORP19 citations92
US5670408ASep 23, 1997
Thin film capacitor with small leakage current and method for fabricating the same
NEC CORP14 citations74
US5530279AJun 25, 1996
Thin film capacitor with small leakage current and method for fabricating the same
NEC CORP10 citations74
US5332684AJul 26, 1994
Method for fabricating thin-film capacitor with restrained leakage current at side and end portions of electrodes in a semiconductor integrated circuit device
NEC CORP16 citations74
US6558463B2May 6, 2003
Solution and method for forming a ferroelectric film
NEC CORP2 citations59
SYMETRIX CORP
7 patentsUS6225656B1May 1, 2001
Ferroelectric integrated circuit with protective layer incorporating oxygen and method for fabricating same
SYMETRIX CORP74 citations96
US6165802ADec 26, 2000
Method of fabricating ferroelectric integrated circuit using oxygen to inhibit and repair hydrogen degradation
SYMETRIX CORP53 citations96
US6512256B1Jan 28, 2003
Integrated circuit having self-aligned hydrogen barrier layer and method for fabricating same
SYMETRIX CORP27 citations93
US6225156B1May 1, 2001
Ferroelectric integrated circuit having low sensitivity to hydrogen exposure and method for fabricating same
SYMETRIX CORP27 citations93
US6207465B1Mar 27, 2001
Method of fabricating ferroelectric integrated circuit using dry and wet etching
SYMETRIX CORP23 citations93
US6130103AOct 10, 2000
Method for fabricating ferroelectric integrated circuits
SYMETRIX CORP26 citations93
US6570202B2May 27, 2003
Ferroelectric integrated circuit having low sensitivity to hydrogen exposure and method for fabricating same
SYMETRIX CORP8 citations74
MIYASAKA YOICHI
2 patentsNIPPON ELECTRIC CO
1 patentShowing the top 50 of 59 patents by PatentIndex Score.