Inventor
TAKEDA YOSHIKI
JP12 patents
⚠️ This page may combine multiple inventors who share the name “TAKEDA YOSHIKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINKO ELECTRIC IND CO
9 patentsUS5410180AApr 25, 1995
Metal plane support for multi-layer lead frames and a process for manufacturing such frames
SHINKO ELECTRIC IND CO220 citations98
US5291060AMar 1, 1994
Lead frame and semiconductor device using same
SHINKO ELECTRIC IND CO43 citations92
US5281556AJan 25, 1994
Process for manufacturing a multi-layer lead frame having a ground plane and a power supply plane
SHINKO ELECTRIC IND CO32 citations92
US5237202AAug 17, 1993
Lead frame and semiconductor device using same
SHINKO ELECTRIC IND CO52 citations92
US5235209AAug 10, 1993
Multi-layer lead frame for a semiconductor device with contact geometry
SHINKO ELECTRIC IND CO36 citations92
US6081426AJun 27, 2000
Semiconductor package having a heat slug
SHINKO ELECTRIC IND CO25 citations90
US5905634AMay 18, 1999
Semiconductor package having a heat slug
SHINKO ELECTRIC IND CO24 citations90
US5854094ADec 29, 1998
Process for manufacturing metal plane support for multi-layer lead frames
SHINKO ELECTRIC IND CO6 citations62
US7226807B2Jun 5, 2007
Method of production of circuit board utilizing electroplating
SHINKO ELECTRIC IND CO6 citations54