Inventor
CHUANG PO-YAO
TW84 patents
Patents
50 patentsUS11527474B2Dec 13, 2022
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations86
US11456257B2Sep 27, 2022
Semiconductor package with dual sides of metal routing
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations86
US11270975B2Mar 8, 2022
Semiconductor packages including passive devices and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations86
US11164754B2Nov 2, 2021
Fan-out packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations86
US11075151B2Jul 27, 2021
Fan-out package with controllable standoff
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations86
US10790162B2Sep 29, 2020
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD14 citations86
US11380666B2Jul 5, 2022
Fan-out package with cavity substrate
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US11101214B2Aug 24, 2021
Package structure with dam structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US10971461B2Apr 6, 2021
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10867924B2Dec 15, 2020
Semiconductor package with redistribution structure and pre-made substrate on opposing sides for dual-side metal routing
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10515827B2Dec 24, 2019
Method for forming chip package with recessed interposer substrate
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations84
US10347574B2Jul 9, 2019
Integrated fan-out packages
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US11610854B2Mar 21, 2023
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations75
US11908764B2Feb 20, 2024
Semiconductor package including a circuit substrate having a cavity and a floor plate embedded in a dielectric material and a semiconductor die disposed in the cavity
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11901307B2Feb 13, 2024
Semiconductor device including electromagnetic interference (EMI) shielding and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11848305B2Dec 19, 2023
Semiconductor packages including passive devices and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11600575B2Mar 7, 2023
Method for forming chip package structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11532867B2Dec 20, 2022
Heterogeneous antenna in fan-out package
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11362010B2Jun 14, 2022
Structure and formation method of chip package with fan-out feature
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11322447B2May 3, 2022
Dual-sided routing in 3D SiP structure
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11322449B2May 3, 2022
Package with fan-out structures
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11302650B2Apr 12, 2022
Package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11296065B2Apr 5, 2022
Semiconductor packages and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11270953B2Mar 8, 2022
Structure and formation method of chip package with shielding structure
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11062997B2Jul 13, 2021
Method for forming chip package structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11063007B2Jul 13, 2021
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10985100B2Apr 20, 2021
Chip package with recessed interposer substrate
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10879162B2Dec 29, 2020
Integrated fan-out packages
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10804254B2Oct 13, 2020
Fan-out package with cavity substrate
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10468339B2Nov 5, 2019
Heterogeneous fan-out structure and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11410982B2Aug 9, 2022
Semiconductor devices and methods of manufacturing
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12476198B2Nov 18, 2025
Package structure with adhesive element over semiconductor chip
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12463161B2Nov 4, 2025
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12412851B2Sep 9, 2025
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12388028B2Aug 12, 2025
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12224266B2Feb 11, 2025
Semiconductor packages including passive devices and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12131984B2Oct 29, 2024
Heterogeneous fan-out structure and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12113025B2Oct 8, 2024
Semiconductor package with dual sides of metal routing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12100666B2Sep 24, 2024
Method for forming chip package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12051654B2Jul 30, 2024
Package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12046548B2Jul 23, 2024
Chip package with redistribution structure having multiple chips
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12021045B2Jun 25, 2024
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11996372B2May 28, 2024
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11996606B2May 28, 2024
Heterogeneous antenna in fan-out package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11804451B2Oct 31, 2023
Package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11670577B2Jun 6, 2023
Chip package with redistribution structure having multiple chips
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11646256B2May 9, 2023
Heterogeneous fan-out structure and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11600573B2Mar 7, 2023
Structure and formation method of chip package with conductive support elements to reduce warpage
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11018081B2May 25, 2021
Heterogeneous fan-out structure and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12564076B2Feb 24, 2026
Chip package with fan-out feature and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
Showing the top 50 of 84 patents by PatentIndex Score.