Inventor

CHEN SHUO-MAO

TW128 patents

⚠️ This page may combine multiple inventors who share the name “CHEN SHUO-MAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN SHUO-MAO

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor structure and manufacturing method thereof

Plurality of semiconductor devices encapsulated by a molding material attached to a redistribution layer

Multi-chip wafer level packages and methods of forming the same

Semiconductor package structure and method of manufacturing the same

Semiconductor structure and manufacturing method thereof

Interconnect structure for package-on-package devices and a method of fabricating

Interconnect structure for package-on-package devices and a method of fabricating

Semiconductor structure and manufacturing method thereof

Package with metal-insulator-metal capacitor and method of manufacturing the same

Semiconductor package with dual sides of metal routing

Semiconductor packages including passive devices and methods of forming same

Semiconductor structure and manufacturing method thereof

Interconnect structure for package-on-package devices

Semiconductor package with redistribution structure and pre-made substrate on opposing sides for dual-side metal routing

Chip package structure

Method for forming chip package with recessed interposer substrate

Interconnect structure for package-on-package devices

Chip package structure and method for forming the same

Interconnect structure for package-on-package devices

Semiconductor package structure

Semiconductor package and manufacturing method of the same

Integrated circuit stack verification method and system for performing the same

Semiconductor package structure and manufacturing method thereof

Integrated circuit stack verification method and system for performing the same

Package structure and method of fabricating the same

Multi-chip packages and methods of forming the same

Integrated circuit package and method forming same

Chip package structure with cavity in interposer

Photonics integrated circuit package

Method for forming package structure with lid

Semiconductor package including a circuit substrate having a cavity and a floor plate embedded in a dielectric material and a semiconductor die disposed in the cavity

Semiconductor packages including passive devices and methods of forming same

Chip package structure

Multi-chip packages

Chip package structure with cavity in interposer

Semiconductor device encapsulated by molding material attached to redestribution layer

Reinforcing package using reinforcing patches

Semiconductor structure and manufacturing method thereof

Photonics integrated circuit package

Semiconductor packages and methods of forming same

TAIWAN SEMICONDUCTOR MFG

Method of fabricating interconnect structure for package-on-package devices

High-gain vertex lateral bipolar junction transistor

Metal pads with openings in integrated circuits

Inductor device having improved quality factor

Packages with passive devices and methods of forming the same

CHEN SHUO-MAO

Package with passive devices and method of forming the same

Profile design for lateral-vertical bipolar junction transistor

YU CHEN-HUA

Packages with passive devices and methods of forming the same

CHEN CHIA-CHUNG

Four-terminal gate-controlled LVBJTs

Chen shuo mao

Package with metal-insulator-metal capacitor and method of manufacturing the same