Inventor

YANG YONG BO

SG3 patents

⚠️ This page may combine multiple inventors who share the name “YANG YONG BO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED TEST & ASSEMBLY CT LT

1 patent

US9165878B2Oct 20, 2015

Semiconductor packages and methods of packaging semiconductor devices

UNITED TEST & ASSEMBLY CT LT6 citations66

UNITED TEST AND ASSEMBLY CENTER LTD

1 patent

US9472532B2Oct 18, 2016

Leadframe area array packaging technology

UNITED TEST AND ASSEMBLY CENTER LTD0 citations45

DIMAANO JR ANTONIO BAMBALAN

1 patent

US9023690B2May 5, 2015

Leadframe area array packaging technology

DIMAANO JR ANTONIO BAMBALAN0 citations40