Inventor

KAO SOOLIN

US2 patents

Patents

2 patents

US5837612ANov 17, 1998

Silicon chemical mechanical polish etch (CMP) stop for reduced trench fill erosion and method for formation

MOTOROLA INC125 citations92

US5963818AOct 5, 1999

Combined trench isolation and inlaid process for integrated circuit formation

MOTOROLA INC63 citations91