Inventor
WEI JIANGHUA
US18 patents
⚠️ This page may combine multiple inventors who share the name “WEI JIANGHUA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAMBDA TECHNOLOGIES INC
8 patentsUS5804801ASep 8, 1998
Adhesive bonding using variable frequency microwave energy
LAMBDA TECHNOLOGIES INC96 citations97
US5798395AAug 25, 1998
Adhesive bonding using variable frequency microwave energy
LAMBDA TECHNOLOGIES INC82 citations96
US5879756AMar 9, 1999
Curing polymer layers on semiconductor substrates using variable frequency microwave energy
LAMBDA TECHNOLOGIES INC63 citations95
US5738915AApr 14, 1998
Curing polymer layers on semiconductor substrates using variable frequency microwave energy
LAMBDA TECHNOLOGIES INC66 citations95
US6103812AAug 15, 2000
Microwave curable adhesive
LAMBDA TECHNOLOGIES INC33 citations92
US5644837AJul 8, 1997
Process for assembling electronics using microwave irradiation
LAMBDA TECHNOLOGIES INC26 citations92
US5844216ADec 1, 1998
System and apparatus for reducing arcing and localized heating during microwave processing
LAMBDA TECHNOLOGIES INC7 citations73
US5750968AMay 12, 1998
System and apparatus for reducing arcing and localized heating during microwave processing
LAMBDA TECHNOLOGIES INC5 citations73
UNIV MICHIGAN STATE
4 patentsUS5844217ADec 1, 1998
Appratus for liquid thermosetting resin molding using radiofrequency wave heating
UNIV MICHIGAN STATE30 citations89
US5770143AJun 23, 1998
Method for liquid thermosetting resin molding using radiofrequency wave heating
UNIV MICHIGAN STATE22 citations89
US5470423ANov 28, 1995
Microwave pultrusion apparatus and method of use
UNIV MICHIGAN STATE10 citations70
US5406056AApr 11, 1995
Electromagnetic curing apparatus and method of use
UNIV MICHIGAN STATE5 citations55