Inventor
HAMANO TOSHIO
JP29 patents
⚠️ This page may combine multiple inventors who share the name “HAMANO TOSHIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
25 patentsUS6433418B1Aug 13, 2002
Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism
FUJITSU LTD178 citations98
US6348728B1Feb 19, 2002
Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer
FUJITSU LTD91 citations98
US6347037B2Feb 12, 2002
Semiconductor device and method of forming the same
FUJITSU LTD99 citations97
US6333564B1Dec 25, 2001
Surface mount type semiconductor device and method of producing the same having an interposing layer electrically connecting the semiconductor chip with protrusion electrodes
FUJITSU LTD87 citations97
US6288444B1Sep 11, 2001
Semiconductor device and method of producing the same
FUJITSU LTD80 citations96
US5804468ASep 8, 1998
Process for manufacturing a packaged semiconductor having a divided leadframe stage
FUJITSU LTD65 citations96
US5497032AMar 5, 1996
Semiconductor device and lead frame therefore
FUJITSU LTD65 citations96
US7193320B2Mar 20, 2007
Semiconductor device having a heat spreader exposed from a seal resin
FUJITSU LTD24 citations92
US6696754B2Feb 24, 2004
Semiconductor module including a plurality of semiconductor devices detachably
FUJITSU LTD20 citations92
US6472744B2Oct 29, 2002
Semiconductor module including a plurality of semiconductor devices detachably
FUJITSU LTD31 citations92
US6462424B1Oct 8, 2002
Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure
FUJITSU LTD28 citations92
US6235997B1May 22, 2001
LSI package with equal length transmission Lines
FUJITSU LTD34 citations92
US6184133B1Feb 6, 2001
Method of forming an assembly board with insulator filled through holes
FUJITSU LTD26 citations92
US6165819ADec 26, 2000
Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure
FUJITSU LTD30 citations92
US6094356AJul 25, 2000
Semiconductor device and semiconductor device module
FUJITSU LTD21 citations92
US5923540AJul 13, 1999
Semiconductor unit having semiconductor device and multilayer substrate, in which grounding conductors surround conductors used for signal and power
FUJITSU LTD28 citations92
US5729435AMar 17, 1998
Semiconductor device and assembly board having through-holes filled with filling core
FUJITSU LTD22 citations92
US5278429AJan 11, 1994
Semiconductor device having improved adhesive structure and method of producing same
FUJITSU LTD52 citations92
US4626960ADec 2, 1986
Semiconductor device having soldered bond between base and cap thereof
FUJITSU LTD49 citations92
US5407502AApr 18, 1995
Method for producing a semiconductor device having an improved adhesive structure
FUJITSU LTD23 citations89
US4999319AMar 12, 1991
Method of manufacturing semiconductor device having package structure
FUJITSU LTD26 citations86
US6307259B1Oct 23, 2001
Plastic package for semiconductor device
FUJITSU LTD16 citations84
US6627479B2Sep 30, 2003
Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer
FUJITSU LTD5 citations74
US6088233AJul 11, 2000
Semiconductor device and assembly board having through-holes filled with filling core
FUJITSU LTD11 citations73
US5978222ANov 2, 1999
Semiconductor device and assembly board having through-holes filled with filling core
FUJITSU LTD11 citations73