Inventor
TU HSIEN-MING
TW35 patents
⚠️ This page may combine multiple inventors who share the name “TU HSIEN-MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
34 patentsUS9627332B1Apr 18, 2017
Integrated circuit structure and seal ring structure
TAIWAN SEMICONDUCTOR MFG CO LTD22 citations94
US9640498B1May 2, 2017
Integrated fan-out (InFO) package structures and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD20 citations93
US10497646B2Dec 3, 2019
Dual-mode wireless charging device
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9559044B2Jan 31, 2017
Package with solder regions aligned to recesses
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US9048149B2Jun 2, 2015
Self-alignment structure for wafer level chip scale package
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US11107772B2Aug 31, 2021
Semiconductor package and method of manufacturing semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10985121B2Apr 20, 2021
Bump structure and fabricating method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10354986B2Jul 16, 2019
Hollow metal pillar packaging scheme
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10269737B2Apr 23, 2019
Method for manufacturing semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10262958B2Apr 16, 2019
Package with solder regions aligned to recesses
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10163828B2Dec 25, 2018
Semiconductor device and fabricating method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9947630B2Apr 17, 2018
Package with solder regions aligned to recesses
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9786618B2Oct 10, 2017
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9461106B1Oct 4, 2016
MIM capacitor and method forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9852985B1Dec 26, 2017
Conductive terminal on integrated circuit
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US9799615B1Oct 24, 2017
Package structures having height-adjusted molding members and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12322696B2Jun 3, 2025
Dual-mode wireless charging device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11735518B2Aug 22, 2023
Dual-mode wireless charging device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US9484318B2Nov 1, 2016
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations63
US12278199B2Apr 15, 2025
Conductive bump of a semiconductor device and fabricating method thereof cross reference to related applications
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12261126B2Mar 25, 2025
Semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11923318B2Mar 5, 2024
Method of manufacturing semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11837562B2Dec 5, 2023
Conductive bump of a semiconductor device and fabricating method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11469200B2Oct 11, 2022
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10879198B2Dec 29, 2020
Package with solder regions aligned to recesses
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10854564B2Dec 1, 2020
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10825804B2Nov 3, 2020
Hollow metal pillar packaging scheme
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10032737B2Jul 24, 2018
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9812434B2Nov 7, 2017
Hollow metal pillar packaging scheme
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9679883B2Jun 13, 2017
Hollow metal pillar packaging scheme
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9318456B2Apr 19, 2016
Self-alignment structure for wafer level chip scale package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10062654B2Aug 28, 2018
Semicondcutor structure and semiconductor manufacturing process thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9748212B2Aug 29, 2017
Shadow pad for post-passivation interconnect structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9943239B2Apr 17, 2018
Optical sensing system and associated electronic device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations42