Inventor

LAI YU-CHIA

TW81 patents

⚠️ This page may combine multiple inventors who share the name “LAI YU-CHIA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LAI YU-CHIA

TAIWAN SEMICONDUCTOR MFG CO LTD

Integrated circuit structure and seal ring structure

Integrated fan-out (InFO) package structures and methods of forming same

Integrated circuit package and method

Integrated fan-out device, 3D-IC system, and method

Multi-chip semiconductor package

Package with solder regions aligned to recesses

Self-alignment structure for wafer level chip scale package

IPD modules with flexible connection scheme in packaging

Semiconductor structure including a semiconductor wafer and a surface mount component overhanging a periphery of the semiconductor wafer

Multi-chip semiconductor package

IPD modules with flexible connection scheme in packaging

Chip package structure including a silicon substrate interposer and methods for forming the same

Packages with thick RDLs and thin RDLs stacked alternatingly

Integrated circuit package and method

Multi-chip semiconductor package

Package structure

Semiconductor structure including a first surface mount component and a second surface mount component and method of fabricating the semiconductor structure

Semiconductor device having a heat dissipation structure connected chip package

IPD modules with flexible connection scheme in packaging

Package structures

Integrated circuit package and method

Semiconductor package and manufacturing method thereof

Bump structure and fabricating method thereof

Hollow metal pillar packaging scheme

Method for manufacturing semiconductor structure

Package with solder regions aligned to recesses

Semiconductor device and fabricating method thereof

Package with solder regions aligned to recesses

Semiconductor structure and manufacturing method thereof

MIM capacitor and method forming the same

Semiconductor package and manufacturing method of semiconductor package

Conductive terminal on integrated circuit

Package structures having height-adjusted molding members and methods of forming the same

Semiconductor device, circuit board structure and manufacturing method thereof

Packages with thick RDLs and thin RDLs stacked alternatingly

Semiconductor device, circuit board structure and manufacturing method thereof

Semiconductor device, circuit board structure and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor structure

Trimming and sawing processes in the formation of wafer-form packages

Package structure with conductive patterns in a redistribution layer

Integrated circuit package and method

Semiconductor device having a heat dissipation structure connected chip package

Integrated circuit package and method

Conductive bump of a semiconductor device and fabricating method thereof cross reference to related applications

Method of fabricating semiconductor structure including a barrier structure in between a plurality of surface mount components and a wafer

LAI YU-CHIA

Electronic device and heat dissipation device thereof

Cooling system for electronic device and electronic device having same

TAIWAN SEMICONDUCTOR MFG

Metal insulator metal capacitor and method for making the same

HON HAI PREC IND CO LTD

Air guiding device and heat dissipation system having same