Inventor
MAHANPOUR MEHRDAD
US23 patents
Patents
23 patentsUS6528332B2Mar 4, 2003
Method and system for reducing polymer build up during plasma etch of an intermetal dielectric
ADVANCED MICRO DEVICES INC72 citations94
US6452234B1Sep 17, 2002
How to improve the ESD on SOI devices
ADVANCED MICRO DEVICES INC31 citations92
US6830941B1Dec 14, 2004
Method and apparatus for identifying individual die during failure analysis
ADVANCED MICRO DEVICES INC44 citations91
US6320400B1Nov 20, 2001
Method and system for selectively disconnecting a redundant power distribution network to indentify a site of a short
ADVANCED MICRO DEVICES INC23 citations90
US7670915B1Mar 2, 2010
Contact liner in integrated circuit technology
ADVANCED MICRO DEVICES INC9 citations84
US6395129B1May 28, 2002
Process to decapsulate a FBGA package
ADVANCED MICRO DEVICES INC14 citations77
US6181153B1Jan 30, 2001
Method and system for detecting faults in a flip-chip package
ADVANCED MICRO DEVICES INC9 citations73
US6030282AFeb 29, 2000
Method and apparatus for holding, grinding and polishing a packaged semiconductor die
ADVANCED MICRO DEVICES INC7 citations73
US6995564B1Feb 7, 2006
Method and system for locating chip-level defects through emission imaging of a semiconductor device
ADVANCED MICRO DEVICES INC10 citations68
US7093209B2Aug 15, 2006
Method and apparatus for packaging test integrated circuits
ADVANCED MICRO DEVICES INC5 citations62
US6770495B1Aug 3, 2004
Method for revealing active regions in a SOI structure for DUT backside inspection
ADVANCED MICRO DEVICES INC2 citations62
US6485361B1Nov 26, 2002
Apparatus for holding and delayering a semiconductor die
ADVANCED MICRO DEVICES INC2 citations62
US6304792B1Oct 16, 2001
Separation of a multi-layer integrated circuit device and package
ADVANCED MICRO DEVICES INC4 citations62
US6127194AOct 3, 2000
Package removal for FBGA devices
ADVANCED MICRO DEVICES INC3 citations62
US6387206B1May 14, 2002
Method and system for plastic package decapsulation of electronic devices
ADVANCED MICRO DEVICES INC3 citations60
US6309899B1Oct 30, 2001
Method and system for removing a die from a semiconductor package
ADVANCED MICRO DEVICES INC4 citations60
US6253353B1Jun 26, 2001
Method and system for providing a library for identifying VCC to ground shorts in a circuit in a semiconductor device
ADVANCED MICRO DEVICES INC2 citations60
US6866416B1Mar 15, 2005
Detecting heat generating failures in unpassivated semiconductor devices
ADVANCED MICRO DEVICES INC6 citations58
US6076686AJun 20, 2000
Support structure for use during package removal from a multi-layer integrated circuit device
ADVANCED MICRO DEVICES INC5 citations58
US6770512B1Aug 3, 2004
Method and system for using TMAH for staining copper silicon on insulator semiconductor device cross sections
ADVANCED MICRO DEVICES INC4 citations55
US6991946B1Jan 31, 2006
Method and system for providing backside voltage contrast for silicon on insulator devices
ADVANCED MICRO DEVICES INC2 citations54
US6227941B1May 8, 2001
Support structure with multi-layer support material for use during package removal from a multi-layer integrated circuit device
ADVANCED MICRO DEVICES INC1 citations52
US6941529B1Sep 6, 2005
Method and system for using emission microscopy in physical verification of memory device architecture
ADVANCED MICRO DEVICES INC1 citations45