Inventor

HSIEH SUNG CHUN

TW6 patents

⚠️ This page may combine multiple inventors who share the name “HSIEH SUNG CHUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WORLDWIDE SEMICONDUCTOR MFG

2 patents

US6228753B1May 8, 2001

Method of fabricating a bonding pad structure for improving the bonding pad surface quality

WORLDWIDE SEMICONDUCTOR MFG34 citations90

US6150235ANov 21, 2000

Method of forming shallow trench isolation structures

WORLDWIDE SEMICONDUCTOR MFG26 citations90

WORLDWIDE SEMICONDUCTOR MANUFA

1 patent

US6022800AFeb 8, 2000

Method of forming barrier layer for tungsten plugs in interlayer dielectrics

WORLDWIDE SEMICONDUCTOR MANUFA13 citations70

MOSEL VITELIC INC

1 patent

US6096645AAug 1, 2000

Method of making IC devices having stable CVD titanium nitride films

MOSEL VITELIC INC7 citations68

TAIWAN SEMICONDUCTOR MFG CORP

1 patent

US6396751B1May 28, 2002

Semiconductor device comprising a test structure

TAIWAN SEMICONDUCTOR MFG CORP6 citations60

TAIWAN SEMICONDUCTOR MFG

1 patent

US7705464B2Apr 27, 2010

Connection structure for semiconductor devices

TAIWAN SEMICONDUCTOR MFG4 citations58