Inventor

KO CHIH-MING

TW3 patents

⚠️ This page may combine multiple inventors who share the name “KO CHIH-MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HSU HUNG-HSIN

2 patents

US8237273B2Aug 7, 2012

Metal post chip connecting device and method free to use soldering material

HSU HUNG-HSIN11 citations80

US8115319B2Feb 14, 2012

Flip chip package maintaining alignment during soldering

HSU HUNG-HSIN15 citations80

POWERTECH TECHNOLOGY INC

1 patent

US9991206B1Jun 5, 2018

Package method including forming electrical paths through a mold layer

POWERTECH TECHNOLOGY INC2 citations65