Inventor
SHENTU JUNLI
CN2 patents
Patents
2 patentsUS9508677B2Nov 29, 2016
Chip package assembly and manufacturing method thereof
SILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD2 citations54
US10333019B2Jun 25, 2019
Package structure of light emitter and light sensor with light-blocking layer and method for manufacturing the same
SILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD0 citations44