Inventor
PARK SU-JEONG
KR5 patents
Patents
5 patentsUS11600552B2Mar 7, 2023
Semiconductor device having a through silicon via and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11488860B2Nov 1, 2022
Integrated circuit device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11043445B2Jun 22, 2021
Semiconductor device having a through silicon via and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations61
US10763163B2Sep 1, 2020
Integrated circuit device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations61
US12543541B2Feb 3, 2026
Semiconductor package with nanotwin copper bond pads
SAMSUNG ELECTRONICS CO LTD0 citations50