Inventor

CHAE SEUNGHUN

KR2 patents

Patents

2 patents

US12469775B2Nov 11, 2025

Semiconductor package including substrate having a dummy pattern between pads

SAMSUNG ELECTRONICS CO LTD0 citations48

US11417595B2Aug 16, 2022

Semiconductor package and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD0 citations48