Inventor
LEE JAEEAN
KR6 patents
Patents
6 patentsUS11990439B2May 21, 2024
Semiconductor package including under bump metallization pad
SAMSUNG ELECTRONICS CO LTD4 citations70
US11088115B2Aug 10, 2021
Interposer and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD4 citations68
US12218099B2Feb 4, 2025
Interposer and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations57
US12489060B2Dec 2, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations48
US12469775B2Nov 11, 2025
Semiconductor package including substrate having a dummy pattern between pads
SAMSUNG ELECTRONICS CO LTD0 citations48
US11417595B2Aug 16, 2022
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations48