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Inventor
MOON SOYEON
KR
2 patents
Patents
2 patents
US12469775B2
Nov 11, 2025
Semiconductor package including substrate having a dummy pattern between pads
SAMSUNG ELECTRONICS CO LTD
0 citations
48
US11417595B2
Aug 16, 2022
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD
0 citations
48