P

Inventor

TAKAHASHI AKIO

JP188 patents
⚠️ This page may combine multiple inventors who share the name “TAKAHASHI AKIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI LTD

27 patents
US6028364AFeb 22, 2000

Semiconductor device having a stress relieving mechanism

HITACHI LTD167 citations98
US5595943AJan 21, 1997

Method for formation of conductor using electroless plating

HITACHI LTD125 citations98
US5565706AOct 15, 1996

LSI package board

HITACHI LTD190 citations98
US5497545AMar 12, 1996

Method of making electrical connections in the manufacture of wiring sheet assemblies

HITACHI LTD59 citations96
US5021296AJun 4, 1991

Circuit board and process for producing the same

HITACHI LTD66 citations96
US4970107ANov 13, 1990

Composite article comprising a copper element and a process for producing it

HITACHI LTD50 citations96
US5538942AJul 23, 1996

Method for producing a superconducting magnet coil

HITACHI LTD54 citations94
US6924971B2Aug 2, 2005

High dielectric constant composite material and multilayer wiring board using the same

HITACHI LTD19 citations93
US5350886ASep 27, 1994

Mounting substrate

HITACHI LTD28 citations93
US6762511B2Jul 13, 2004

Thermosetting resin composition

HITACHI LTD16 citations92
US6638352B2Oct 28, 2003

Thermal stable low elastic modulus material and device using the same

HITACHI LTD31 citations92
US6423571B2Jul 23, 2002

Method of making a semiconductor device having a stress relieving mechanism

HITACHI LTD35 citations92
US6344273B1Feb 5, 2002

Treatment solution for forming insulating layers on magnetic particles process for forming the insulating layers, and electric device with a soft magnetic powder composite core

HITACHI LTD16 citations92
US6326561B1Dec 4, 2001

Thin-film multilayer wiring board with wiring and via holes in a thickness of an insulating layer

HITACHI LTD39 citations92
US6225418B1May 1, 2001

Thermosetting resin composition

HITACHI LTD18 citations92
US6190834B1Feb 20, 2001

Photosensitive resin composition, and multilayer printed circuit board using the same

HITACHI LTD44 citations92
US6190493B1Feb 20, 2001

Thin-film multilayer wiring board and production thereof

HITACHI LTD31 citations92
US6054219AApr 25, 2000

Process for forming insulating layers on soft magnetic powder composite core from magnetic particles

HITACHI LTD40 citations92
US5914216AJun 22, 1999

Multilayer circuit board and photosensitive resin composition used therefor

HITACHI LTD18 citations92
US5849460ADec 15, 1998

Photosensitive resin composition and method for using the same in manufacture of circuit boards

HITACHI LTD26 citations92
US5768108AJun 16, 1998

Multi-layer wiring structure

HITACHI LTD35 citations92
US4710854ADec 1, 1987

Hybrid multilayer wiring board

HITACHI LTD46 citations92
US4526835AJul 2, 1985

Multi-layer printed circuit board and process for production thereof

HITACHI LTD45 citations92
US5707749AJan 13, 1998

Method for producing thin film multilayer wiring board

HITACHI LTD31 citations91
US5457079AOct 10, 1995

Copper-based oxidation catalyst and its applications

HITACHI LTD25 citations91
US5384197AJan 24, 1995

Superconducting magnet coil and curable resin composition used therein

HITACHI LTD27 citations91
US5294291AMar 15, 1994

Process for the formation of a conductive circuit pattern

HITACHI LTD24 citations89

HONDA MOTOR CO LTD

9 patents

ASAHI OPTICAL CO LTD

4 patents

TOYOTA MOTOR CO LTD

2 patents

HITACHI CHEMICAL CO LTD

2 patents

HONJI YOSHIKAZU

1 patent

YAMAHA CORP

1 patent

TOYODA CHUO KENKYUSHO KK

1 patent

AGENCY IND SCIENCE TECHN

1 patent

HOOKER CHEMICALS PLASTICS CORP

1 patent

AMERICAN CAN CO

1 patent

Showing the top 50 of 188 patents by PatentIndex Score.