Inventor
MEAD DONALD I
US7 patents
Patents
7 patentsUS6173887B1Jan 16, 2001
Method of making electrically conductive contacts on substrates
IBM39 citations92
US6513701B2Feb 4, 2003
Method of making electrically conductive contacts on substrates
IBM19 citations83
US7101782B2Sep 5, 2006
Method of making a circuitized substrate
IBM10 citations72
US6524888B2Feb 25, 2003
Method of attaching a conformal chip carrier to a flip chip
IBM6 citations71
US6337509B2Jan 8, 2002
Fixture for attaching a conformal chip carrier to a flip chip
IBM7 citations71
US7037819B2May 2, 2006
Method of making a circuitized substrate
IBM3 citations61
US6818988B2Nov 16, 2004
Method of making a circuitized substrate and the resultant circuitized substrate
IBM3 citations61