Inventor
NUMOTO MINORU
JP24 patents
⚠️ This page may combine multiple inventors who share the name “NUMOTO MINORU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOKYO SEIMITSU CO LTD
22 patentsUS6059636AMay 9, 2000
Wafer polishing apparatus
TOKYO SEIMITSU CO LTD73 citations96
US5931725AAug 3, 1999
Wafer polishing machine
TOKYO SEIMITSU CO LTD100 citations96
US6402589B1Jun 11, 2002
Wafer grinder and method of detecting grinding amount
TOKYO SEIMITSU CO LTD28 citations92
US6273804B1Aug 14, 2001
Apparatus for polishing wafers
TOKYO SEIMITSU CO LTD40 citations92
US6203414B1Mar 20, 2001
Polishing apparatus
TOKYO SEIMITSU CO LTD34 citations92
US6027398AFeb 22, 2000
Wafer polishing apparatus
TOKYO SEIMITSU CO LTD44 citations91
US4765181AAug 23, 1988
Surface texture measuring instrument
TOKYO SEIMITSU CO LTD27 citations89
US6296555B1Oct 2, 2001
Wafer machining apparatus
TOKYO SEIMITSU CO LTD15 citations84
US6840845B2Jan 11, 2005
Wafer polishing apparatus
TOKYO SEIMITSU CO LTD9 citations74
US6319106B2Nov 20, 2001
Wafer polishing apparatus
TOKYO SEIMITSU CO LTD12 citations74
US6283828B1Sep 4, 2001
Wafer polishing apparatus
TOKYO SEIMITSU CO LTD5 citations74
US5948206ASep 7, 1999
Apparatus for determining removed amount of wafer
TOKYO SEIMITSU CO LTD10 citations74
US6302762B1Oct 16, 2001
Wafer polishing apparatus
TOKYO SEIMITSU CO LTD8 citations73
US6080049AJun 27, 2000
Wafer polishing apparatus
TOKYO SEIMITSU CO LTD7 citations72
US7056196B2Jun 6, 2006
Wafer polisher
TOKYO SEIMITSU CO LTD5 citations63
US6702658B2Mar 9, 2004
Wafer polishing apparatus utilizing an Oldham's coupling mechanism for the wafer carrier
TOKYO SEIMITSU CO LTD3 citations63
US6572438B2Jun 3, 2003
Structure of polishing head of polishing apparatus
TOKYO SEIMITSU CO LTD5 citations63
US6346037B1Feb 12, 2002
Wafer polishing machine
TOKYO SEIMITSU CO LTD4 citations63
US6354914B1Mar 12, 2002
Wafer polishing apparatus
TOKYO SEIMITSU CO LTD3 citations62
US6648739B2Nov 18, 2003
Wafer polishing apparatus
TOKYO SEIMITSU CO LTD3 citations55
US6485358B2Nov 26, 2002
Wafer polishing device
TOKYO SEIMITSU CO LTD6 citations54
US6656026B2Dec 2, 2003
Wafer polishing apparatus
TOKYO SEIMITSU CO LTD0 citations52