Inventor · disambiguated record
Erwin Orejola
Also filed as: OREJOLA ERWIN
2 granted patents·1 pending application·0 citations·filing 2009–2021
23Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0150US11908823B2Devices incorporating stacked bonds and methods of forming the sameWOLFSPEED INC·Filed 2021·Granted Feb 20, 2024·0 cites·37 claims
- 0241US9373577B2Hybrid semiconductor packageINFINEON TECHNOLOGIES CORP·Filed 2013·Granted Jun 21, 2016·0 cites·22 claims
- 0336US2010181675A1Semiconductor package with wedge bonded chipINFINEON TECHNOLOGIES AG·Filed 2009·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →