Inventor
TSUYUKI HIROSHI
JP27 patents
⚠️ This page may combine multiple inventors who share the name “TSUYUKI HIROSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
OLYMPUS OPTICAL CO
6 patentsUS5916148AJun 29, 1999
Objective optical system for endoscopes
OLYMPUS OPTICAL CO192 citations99
US5547457AAug 20, 1996
Objective optical system for endoscopes
OLYMPUS OPTICAL CO198 citations99
US6069651AMay 30, 2000
Imaging apparatus for endoscopes
OLYMPUS OPTICAL CO89 citations97
US6206825B1Mar 27, 2001
Illumination system for endoscopes and an endoscope having the illumination system
OLYMPUS OPTICAL CO64 citations96
US5876327AMar 2, 1999
Imaging apparatus for endoscopes
OLYMPUS OPTICAL CO79 citations96
US5424877AJun 13, 1995
Observation optical system for endoscopes
OLYMPUS OPTICAL CO41 citations92
OLYMPUS CORP
6 patentsUS6985170B1Jan 10, 2006
Image pickup apparatus
OLYMPUS CORP79 citations98
US11607114B2Mar 21, 2023
Endoscope, method for adjustment of endoscope, and image pickup apparatus
OLYMPUS CORP4 citations75
US10893793B2Jan 19, 2021
Objective optical system and endoscope device including the same
OLYMPUS CORP2 citations73
US10205888B2Feb 12, 2019
Endoscope system
OLYMPUS CORP3 citations72
US11857158B2Jan 2, 2024
Optical system, endoscope apparatus and endoscope
OLYMPUS CORP1 citations62
US10914936B2Feb 9, 2021
Endoscope and image pickup apparatus
OLYMPUS CORP1 citations62
TDK CORP
4 patentsUS5378662AJan 3, 1995
Glass, dielectric composition, multilayer wiring substrate, and multilayer ceramic capacitor
TDK CORP95 citations96
US5948536ASep 7, 1999
Glass composition for substrates with a built-in lead base dielectric material, and multilayer substrate with a built-in capacitor
TDK CORP29 citations92
US4737416AApr 12, 1988
Formation of copper electrode on aluminum nitride
TDK CORP14 citations72
US6738251B2May 18, 2004
Conductive pattern incorporated in a multilayered substrate, multilayered substrate incorporating a conductive pattern, and a method of fabricating a multilayered substrate
TDK CORP0 citations52